Wafer inspection in a bright, organized semiconductor research lab
B&N Global KoreaR&D

Taking memory
to the next level.

From enterprise memory to AI server modules,
we plan a step-by-step expansion of Korean R&D capability.

SEMICONDUCTOR VALUE CHAIN

R&D DEVELOPMENT PLAN · KOREA

RESEARCH DIRECTION

R&D CENTER · PLANWe start with the research organization and infrastructure.

The plan is to recruit a research director and development staff, and build a domestic research organization managing the product roadmap, chip design, and process engineering. All R&D schedules and products on this page are future plans based on the 2026 company brochure.

PLANNED PORTFOLIO

ENTERPRISE eMCP

Enterprise eMCP

High-value eMCP products for IoT, industrial equipment, and automotive assist systems

  • LPDDR5X adoption under review
  • Transition toward UFS 4.0 and CXL memory
PLANNED

ENTERPRISE SSD

Enterprise SSD

Enterprise SSD development with datacenter-grade reliability and thermal control

  • In-house SSD controller IC design
  • High-reliability thermal management
PLANNED

AI SERVER MODULE

Next-gen AI memory

Research on next-generation server memory modules working with AI accelerators

  • DDR5 server modules
  • HBM module validation
PLANNED

DEVELOPMENT MILESTONES

  1. 2026.08

    FOUNDATION

    R&D Center establishment

    Recruiting the research team and building development infrastructure
    PLAN
  2. 2027.H1

    ENTERPRISE

    Enterprise product development

    Enterprise eMCP · SSD development
    PLAN
  3. 2027.H2

    AI COMPUTING

    AI server module development

    Next-generation memory modules for AI accelerators
    PLAN
2026—2028 GROWTH PLAN

See the full growth roadmap.

Roadmap

BUILD THE NEXT VALUE CHAIN

Building a stronger semiconductor
value chain, together.

The next journey of B&N Global Korea — connecting
secure supply, technology, and global expansion.